Rruga Peti, Pallati 1 , Ap.8
Tirana , Albania
POWERED BY
Official partner of RECOM Technologies in Albania
Shingled technology eliminates traditional ribbon connection with shingles connected in series. By removing the soldered ribbons, the active area of the module is improved and thermal stresses are reduced – resulting in exceptional efficiency and reliability over standard interconnections. Puma modules are based on the shingled technology which allow a higher cells density than standard half-cut modules.
Shingled technology eliminates traditional ribbon connection with shingles connected in series. By removing the soldered ribbons, the active area of the module is improved and thermal stresses are reduced – resulting in exceptional efficiency and reliability over standard interconnections. Puma modules are based on the shingled technology which allow a higher cells density than standard half-cut modules.
Shingled technology eliminates traditional ribbon connection with shingles connected in series. By removing the soldered ribbons, the active area of the module is improved and thermal stresses are reduced – resulting in exceptional efficiency and reliability over standard interconnections. Puma modules are based on the shingled technology which allow a higher cells density than standard half-cut modules.
Shingled technology eliminates traditional ribbon connection with shingles connected in series. By removing the soldered ribbons, the active area of the module is improved and thermal stresses are reduced – resulting in exceptional efficiency and reliability over standard interconnections. Puma modules are based on the shingled technology which allow a higher cells density than standard half-cut modules.
Shingled technology eliminates traditional ribbon connection with shingles connected in series. By removing the soldered ribbons, the active area of the module is improved and thermal stresses are reduced – resulting in exceptional efficiency and reliability over standard interconnections. Puma modules are based on the shingled technology which allow a higher cells density than standard half-cut modules.
Shingled technology eliminates traditional ribbon connection with shingles connected in series. By removing the soldered ribbons, the active area of the module is improved and thermal stresses are reduced – resulting in exceptional efficiency and reliability over standard interconnections. Puma modules are based on the shingled technology which allow a higher cells density than standard half-cut modules.
Shingled technology eliminates traditional ribbon connection with shingles connected in series. By removing the soldered ribbons, the active area of the module is improved and thermal stresses are reduced – resulting in exceptional efficiency and reliability over standard interconnections. Puma modules are based on the shingled technology which allow a higher cells density than standard half-cut modules.
Shingled technology eliminates traditional ribbon connection with shingles connected in series. By removing the soldered ribbons, the active area of the module is improved and thermal stresses are reduced – resulting in exceptional efficiency and reliability over standard interconnections. Puma modules are based on the shingled technology which allow a higher cells density than standard half-cut modules.